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Effect of Silica Particles on the Enhancement of Mechanical Properties and Thermal Conductivity of the Epoxy Composites


Hamid M. Mahan, Dr. Salwa A . Abed, Thaer G. Shaalan
Abstract

In the present research, the effect of micro silica (sio2) percentage on mechanical properties as well as the thermal conductivity properties of the epoxy compound with different Weight amount (5%,10%,15%,20%,25%) to the resin. Glacial silica particle size was introduced in 8 μm, therefore, Mechanical tests, which include: hardness , impact, flexural, tensile tests completed on prepared composite samples. The thermal conductivity test was also performed on samples. The results indicated that all silica percentage increasing mechanical properties of an epoxy composite with ideal percentage was 20% excepted flexural strength was decreasing.

Volume 10 | 06 - Special Issue

Pages: 748-755